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HS编码 商品名称 退税率 计量单位 海关监管 申报要素·检疫 编码对比
84864010.00 主要用于或专用于制作和修复掩膜版或投影掩膜版的装置
[Apparatus solely or principally of a kind used for the manufacture or repair of masks and reticles]
13% 台/千克 查看详情 --
84864021.00 塑封机
[Plastics encapsulating machines (mainly or exclusively used for assembling and encapsulating semiconductor devices and integrated circuit devices)]
13% 台/千克 查看详情 对比-84864010.00
84864022.00 引线键合装置
[Wire bonding device]
13% 台/千克 查看详情 对比-84864021.00
84864029.00 其他主要或专用于装配封装半导体器件和集成电路的设备
[Other machines solely or principally of a kind used for assembling or encapsulating semiconductor devices or electronic integrated circuits]
13% 台/千克 查看详情 对比-84864022.00
84864031.00 IC工厂专用的自动搬运机器人
[Automated material handling machines solely or principally of a kind used in the electronic integrated circuits factories]
13% 台/千克 查看详情 对比-84864029.00
84864039.00 其他用于升降、装卸、搬运集成电路等的设备
[Other machines for lifting, handling, loading or unloading of electronic integrated circuits (apparatus used for lifting, handling, loading or unloading of boules, wafers, semiconductor devices, electronic integrated circuits and flat panel displays)]
13% 台/千克 查看详情 对比-84864031.00
84864022.01 (已作废)
推荐查询: 84864022 或者: 848640
全自动铝丝焊接机 17.00 台/ 查看详情 对比-84864039.00
84864022.10 (已作废)
推荐查询: 84864022 或者: 848640
全自动铝丝焊接机
[Automatic aluminum foil welding apparatus(machines solely or principally of a kind used for assembling or encapsulating semiconductor devices or elctronic integrated circuits)]
17% 台/无 查看详情 对比-84864022.01
84864022.20 (已作废)
推荐查询: 84864022 或者: 848640
全自动铜丝焊接机
[Full automatic wire welding machine(mainly for or dedicated to theassembly and packaging of semiconductor devices and integrated circuits equipment)]
17% 台/无 查看详情 对比-84864022.10
84864022.30 (已作废)
推荐查询: 84864022 或者: 848640
全自动金丝焊接机
[Full automatic gold wire welding machine(mainly for or dedicated to theassembly and packaging of semiconductor devices and integrated circuitsequipment)]
17% 台/无 查看详情 对比-84864022.20
84864022.90 (已作废)
推荐查询: 84864022 或者: 848640
其他引线键合装置
[Other types of lead bonding device (mainly or exclusively used for assembling and encapsulating semiconductor devices and integrated circuit devices)]
17% 台/无 查看详情 对比-84864022.30
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