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您查询的相关hs编码  15 条,您的查询关键词  wafer
HS编码 品名 实例汇总 申报要素·退税 编码对比
90308200.00 测试或检验半导体晶圆或器件(包括集成电路)用的仪器
(测试或检验半导体晶圆或器件(包括集成电路)用的仪器)
[Other instruments and apparatus For measuring or checking semiconductor wafers or devices]
476条 查看详情 --
84864039.00 其他用于升降、装卸、搬运集成电路等的设备
(其他用于升降、装卸、搬运集成电路等的设备升降、装卸、搬运单晶柱、晶圆、半导体器件、集成电路和平板显示器的装置)
[Other machines for lifting, handling, loading or unloading of electronic integrated circuits (apparatus used for lifting, handling, loading or unloading of boules, wafers, semiconductor devices, electronic integrated circuits and flat panel displays)]
228条 查看详情 对比-90308200.00
19059000.00 其他面包,糕点,饼干及烘焙糕饼
(其他面包,糕点,饼干及烘焙糕饼包括装药空囊、封缄、糯米纸及类似制品)
[Other bread, pastry, cakes, biscuits and bakers’ wares(including empty cachets of a kind suitable for pharmaceutical use, sealing wafers, rice paper and similar products)]
205条 查看详情 对比-84864039.00
38180011.00 7.5cm≤直径≤15.24cm单晶硅片
(7.5cm≤直径≤15.24cm单晶硅片经掺杂用于电子工业的)
[Monocrystalline sillicon, in the form of discs, wafers or similar form, diameter 7.5cm or more but not exceeding 15.24cm, chemical compounds doped for use in electronics]
102条 查看详情 对比-19059000.00
90314100.00 制造半导体器件(包括集成电路)时检验半导体晶圆、器件(包括集成电路)或检测光掩模或光栅用的仪器和器具
(制造半导体器件(包括集成电路)时检验半导体晶圆、器件(包括集成电路)或检测光掩模或光栅用的仪器和器具第90章其他税目未列名的)
[Other optical instruments and appliances For inspecting semiconductor wafers or devices or for inspecting photomasks or reticles used in manufacturing semiconductor devices]
73条 查看详情 对比-38180011.00
84861030.00 制造单晶柱或晶圆用的切割设备
(制造单晶柱或晶圆用的切割设备)
[Sawing machines for the manufacture of boules or wafers]
70条 查看详情 对比-90314100.00
84861090.00 其他制造单晶柱或晶圆用的机器及装置
(其他制造单晶柱或晶圆用的机器及装置)
[Other machines and apparatus for the manufacture of boules or wafers]
60条 查看详情 对比-84861030.00
84861020.00 制造单晶柱或晶圆用的研磨设备
(制造单晶柱或晶圆用的研磨设备)
[Grinding machines for the manufacture of boules or wafers]
35条 查看详情 对比-84861090.00
19053200.00 华夫饼干及圣餐饼
(华夫饼干及圣餐饼)
[Waffles and wafers]
26条 查看详情 对比-84861020.00
84861010.00 利用温度变化处理单晶硅的机器及装置
(利用温度变化处理单晶硅的机器及装置制造单晶柱或晶圆用的)
[Machines and apparatus for the treatment of monocrystalline sillicon by a process involving a change of temperature (used for the manufacture of boules or wafers)]
22条 查看详情 对比-19053200.00
84861040.00 制造单晶柱或晶圆用的化学机械抛光设备(CMP)
(制造单晶柱或晶圆用的化学机械抛光设备(CMP))
[Chemical mechanical polishers(CMP) for the manufacture of boules or wafers]
14条 查看详情 对比-84861010.00
45041000.10 压制软木塞
(压制软木塞包括任何形状的压制软木的砖、瓦、实心圆柱体、圆片)
[Suppression of cork(including any shape of agglomerated cork brick and tile, solid cylinder, wafer)]
0条 查看详情 对比-84861040.00
45041000.90 块,板,片及条状压制软木,压制软木塞除外
(块,板,片及条状压制软木,压制软木塞除外包括任何形状的压制软木的砖、瓦、实心圆柱体、圆片)
[Blocks, plates, sheets and strips,excluding suppression of cork(including any shape of agglomerated cork brick and tile, solid cylinder, wafer)]
0条 查看详情 对比-45041000.10
85414100.10 氮化镓外延片
(氮化镓外延片)
[Gallium Nitride Epitaxial Wafer]
0条 查看详情 对比-45041000.90
39199090.10 半导体晶圆制造用自粘式圆形抛光垫
(半导体晶圆制造用自粘式圆形抛光垫)
[The self-adhesive circular polishing pad for semiconductor wafer fabrication]
0条 查看详情 对比-85414100.10
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