8007003000 锡箔,厚度(衬背除外)≤0.2毫米,锡粉及片状粉末
| 商品编码 | 80070030.00 | ||||
| 商品名称 | 锡箔,厚度(衬背除外)≤0.2毫米,锡粉及片状粉末 | ||||
| 商品描述 | 锡箔,厚度(衬背除外)≤0.2毫米,锡粉及片状粉末锡箔不论是否印花或用纸、纸板、塑料或类似材料衬背 | ||||
| 英文名称 | Tin foil(whether or not printed or backed with paper, paperboard, plastics or similar backin gmaterials), of a thickness(excluding any backing not exceeding 0.2mm; tin powders and flakes) | ||||
申报实例汇总
| HS编码 | 商品名称 | 商品规格 |
| 80070030.00 | 锡球 | 粉末球状|锡合金|无衬背|0.5mm等 |
| 80070030.00 | 锡球/粉末球状 | 材质：锡合金；状态：无衬背；规格：直径0.25-0.76MM |
| 80070030.00 | 锡焊片 | 片|锡|有衬背，衬背材料：铜板|1.5*0.4*0.3 |
| 80070030.00 | 锡箔/DENKA牌/65mm*50M | (厚度0.174mm/#712) |
| 80070030.00 | 锡粉,非工业用,锯片结合剂 | 型号:SN2379A25 |
| 80070030.00 | 锡球,粉末状,锡,无衬背 | SOLDER BALL |
| 80070030.00 | 锡粉,形状:粉,材质:锡 | PF305-T0,粉末粒度:15-50微米 |
| 80070030.00 | 锡粉 | SN:99.9%MIN |
| 80070030.00 | 锡粉 D1 2BN | SOLDER POWDER |
| 80070030.00 | 无衬背锡箔 | 5.8*0.15mm(6400.0024) |
| 80070030.00 | 锡粉. | S3X58 锡96.5%银3%铜0.5% |
| 80070030.00 | 锡箔/厚度<=0.2mm | . |
| 80070030.00 | 锡粉,非工业用 | TIN POWDER |
| 80070030.00 | 锡粉SOLDER POWDER,片状合金粉末,材质:锡。 | 3微米<平均粒径><0.2MM,锡63%铅37%。 |
| 80070030.00 | 锡粉/KESTER牌/制造焊锡膏的原料 | 6337等 |
| 80070030.00 | 锡纸胶带 | TAPE |
| 80070030.00 | 焊锡球 | 成分:10%锡,90%铅 |
| 80070030.00 | 管芯锡焊条/品牌:COINING | 厚度0.005,无衬背 20000PCS(20K) |
| 80070030.00 | 镀锡隔热片 | 125996100 EMP-830厚度小于0.2mm |
| 80070030.00 | 锡箔A-50F/KB7-SILVER,形状:箔黑色成卷状. | 规格:厚0.02MM,材质:锡,状态:无衬背. |
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