| HS编码 | 商品名称 | 退税率 | 计量单位 | 海关监管 | 申报要素·检疫 | 编码对比 |
| 32141010.00 | 半导体器件封装材料
[Encapsulation material of semiconductor device] |
13% | 千克/无 | 查看详情 | -- | |
| 32141090.00 | 其他安装玻璃用油灰等;漆工用填料
[Glaziers' putty; painters' fillings(including grafting putty, resin cements, caulking compounds and other mastics)] |
13% | 千克/无 | 查看详情 | 对比-32141010.00 |